Technical Business Development Specialist (m/f/d)

Education

• Master’s degree or Ph.D. in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, Semiconductor Engineering or related disciplines.

Experience

Required:

• Minimum 15 years of semiconductor industry experience.
• Minimum 10 years of experience in one or more of the following areas:
• Advanced Packaging
• Wafer Bonding
• Hybrid Bonding
• Lithography
• Process Integration
• Semiconductor Equipment Development

Preferred:

• Experience with leading semiconductor manufacturers, OSATs or semiconductor equipment suppliers.
• Experience interacting with senior technical leadership and executive management.

Personal Attributes

• Strong technical leadership and influence skills.
• Excellent communication and presentation capabilities.
• Ability to engage with both technical and executive audiences.
• Self-driven and comfortable operating in a highly dynamic environment.
• Willingness to travel internationally.

Technology Scouting & Market Intelligence

• Monitor industry trends and emerging technologies in semiconductor manufacturing and advanced packaging.
• Identify future equipment opportunities related to:
• Hybrid Bonding
• Wafer-to-Wafer Bonding
• Die-to-Wafer Bonding
• Temporary Bonding & Debonding
• Advanced Packaging Lithography
• RDL Processing
• Heterogeneous Integration
• Chiplet Integration
• Silicon Photonics
• Co-Packaged Optics (CPO)
• Glass Core Packaging
• HBM Packaging Technologies
• Analyze competitive technology developments and provide strategic recommendations.

Strategic Customer Engagement

• Establish and maintain technical relationships with key customer engineering and technology organizations.
• Support technical discussions with process integration, module engineering, R&D and advanced packaging teams.
• Participate in customer technology reviews, workshops and roadmap discussions.
• Serve as a trusted technical advisor to strategic customers.

Product & Technology Strategy

• Translate customer technology requirements into actionable product development recommendations.
• Support long-term product roadmap planning for:
• Wafer Bonding Systems
• Temporary Bonding & Debonding Platforms
• Hybrid Bonding Solutions
• Advanced Packaging Lithography Systems
• Large Field Exposure Technologies
• Identify technology gaps and future investment opportunities.

Competitive Intelligence

• Monitor competitive activities, product launches and technology roadmaps.
• Benchmark competitor solutions and identify differentiation opportunities.
• Deliver regular market and technology assessment reports.

Business Development Support

• Support strategic account planning and opportunity development.
• Prepare technical presentations, technology assessments and business case evaluations.
• Support major customer pursuits and technology evaluations.

Industry Engagement

• Represent the company at major industry conferences and technical forums.
• Build relationships with semiconductor research institutes, industry organizations and ecosystem partners.
• Maintain awareness of emerging technology developments across the semiconductor industry.