SÜSS MicroTec SE
Application Engineer for Bonder
Publiziert am: 19.12.25 | Singapur | Vollzeit
Jetzt bewerben- Degree in Engineering/Science from a recognised university.
- Minimum 5 years of related work experience in Lithography wafer process engineering.
- Self-driven and strong team player with keen technical ability, systematic approach, detailed-oriented, excellent problem solving skills, and positive attitude.
- Ability to work independently, be hands-on and expected to dive into technical details as required to cover thinly-resourced areas.
- Ability to work on a fast-paced and challenge work environment.
- Good interpersonal and communication skills.
- Travel is required > 50%
Qualifications
- Provide application support on SUSS MicroTec bonder tools.
- Responsible for project execution, recipe optimization, basic process training and improvement programs with the customer to effectively demonstrate the capability of new tools and/or technology.
- Supporting Product Specialist with defining process spec and ATP for customers.
- Perform final acceptance test of machines at customer site to demonstrate condition of machine and achieve final sign-off.
- Develop creative solutions to resolve customers' concerns and innovative solutions to cater to customer needs.
SÜSS MicroTec SE
Schleißheimer Str. 90
85748 Garching
Schleißheimer Str. 90
85748 Garching
